Percipio Technology
Chinese industrial machine-vision company (formerly Tuyang / 图漾) building a full line of 3D cameras — direct-ToF (T-series), dot-pattern structured-light (G/F/P-series) and fringe-pattern structured-light (V/U-series) — alongside the RVS (Robot Vision Suite) graphical low-code vision software and packaged solutions for bin-picking, de-stacking, parcel dimensioning and fastening. Cameras ship with the Camport SDK, serving robotics, logistics and industrial inspection.
- 112 Liangxiu Road, Pudong New Area, Shanghai, China
- www.percipio.xyz
- Latest productPercipio Storage-Bin / Parcel Volume Efficiency Solution1mo ago
Integrated 3D-vision solution measuring the volume utilisation (fill efficiency) of storage bins and parcel boxes for warehouse optimisation.
Colour fringe-pattern structured-light 3D camera: 0.85–2.1 m, 2048×1536 depth, 0.065 mm accuracy, 5 MP colour.
Colour fringe-pattern structured-light 3D camera: 1.2–3.0 m, 2048×1536 depth, 0.08 mm accuracy, 5 MP colour.
Percipio Storage-Bin / Parcel Volume Efficiency Solution
Integrated 3D-vision solution measuring the volume utilisation (fill efficiency) of storage bins and parcel boxes for warehouse optimisation.
VMD03-8521(C)
Colour fringe-pattern structured-light 3D camera: 0.85–2.1 m, 2048×1536 depth, 0.065 mm accuracy, 5 MP colour.
VMD03-1230(C)
Colour fringe-pattern structured-light 3D camera: 1.2–3.0 m, 2048×1536 depth, 0.08 mm accuracy, 5 MP colour.
VMD02-5011
High-precision fringe-pattern structured-light 3D camera: 0.5–1.1 m, 2048×1536 depth, 30 µm accuracy, 51°/41° FOV.
VMD02-4070
High-precision fringe-pattern structured-light 3D camera: 0.4–0.7 m, 2048×1536 depth, 18 µm accuracy, 51°/41° FOV.
USD01-2550
Consumer-priced fringe-pattern structured-light 3D camera: 0.25–0.5 m, 2064×1552 depth, 30 µm accuracy, 51°/39° FOV.
TM262-E1
dToF LiDAR depth camera: ultra-wide 120°/50° FOV, 0.05–8 m range, 240×96 depth, IP65 — depth + IR only (no RGB).
RVS (Robot Vision Suite)
Graphical low-code machine-vision platform for building 3D-vision applications: bin picking, de-stacking, pose estimation, hand-eye calibration and robot communication.